材料物理科技英語(yǔ)

定　價(jià)：￥25.00

作　者：	毛樣武
出版社：	知識(shí)產(chǎn)權(quán)出版社
叢編項(xiàng)：
標(biāo)　簽：	科技英語(yǔ) 外語(yǔ) 行業(yè)英語(yǔ)

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ISBN：	9787513038003	出版時(shí)間：	2015-09-01	包裝：	平裝
開(kāi)本：	32開(kāi)	頁(yè)數(shù)：	184	字?jǐn)?shù)：

內(nèi)容簡(jiǎn)介

　　材料物理是物理學(xué)與材料科學(xué)的一個(gè)交叉學(xué)科，是材料科學(xué)的重要分支。由于不同高校材料物理專(zhuān)業(yè)的人才培養(yǎng)方向有所不同，由于該行業(yè)技術(shù)革新迅速，因此通過(guò)英文論文和專(zhuān)利等了解該行業(yè)的最新進(jìn)展等較為必要，另外，很多進(jìn)口鍍膜設(shè)備的操作說(shuō)明和界面等均為英文。在此背景下，我們教研室組織編寫(xiě)了面向微電子及光電等行業(yè)的材料物理專(zhuān)業(yè)英語(yǔ)。主要包括七章，分別包括材料科學(xué)基礎(chǔ)、等離子體、真空技術(shù)、薄膜沉積、器件制備工藝、專(zhuān)業(yè)文獻(xiàn)閱讀（科技論文、專(zhuān)利、設(shè)備操作說(shuō)明書(shū)）、科技論文寫(xiě)作等部分。

作者簡(jiǎn)介

　　毛樣武，2006年畢業(yè)于北京航空航天大學(xué)，獲工學(xué)博士學(xué)位。2009-2011在意大利都靈理工大學(xué)從事博士后研究，2012年入選湖北省楚天學(xué)者計(jì)劃楚天學(xué)子。目前在武漢工程大學(xué)材料學(xué)院從事教學(xué)與科研工作，講授課程包括材料物理英語(yǔ)、復(fù)合材料及微納加工技術(shù)等。主持國(guó)家自然科學(xué)基金及湖北省教育廳重點(diǎn)項(xiàng)目等。在國(guó)內(nèi)外期刊上發(fā)表論文二十余篇，并參與編寫(xiě)《粉末冶金手冊(cè)》中“粉末冶金在航空航天的應(yīng)用”章節(jié)。

圖書(shū)目錄

目錄Contents
Unit 1 Basis of Materials Science ·············1
1.1 Introduction ···············································1
1.2 Materials Science and Engineering·····················3
1.3 Classification of Materials·······························8
1.4 Advanced Materials ···································· 14
1.5 Microstructure characterization of Materials········ 19
Unit 2 Plasmas ··································· 42
2.1 DC Glow Discharge ···································· 44
2.2 RF Discharges··········································· 47
2.3 High-Density Plasmas ································· 50
Unit 3 Vacuum Technology···················· 59
3.1 Pressure Ranges and Vacuum Pumps ················ 60
3.2 Vacuum Seals and Pressure Measurement··········· 69
Unit 4 Thin Film Deposition ··················· 76
4.1 Physical Deposition ···································· 77
目錄
VI
4.2 Chemical Deposition ··································· 83
4.3 Epitaxial Growth········································ 94
Unit 5 Devices Fabrication Process ······ 102
5.1 Introduction ············································102
5.2 Ion implantation ·······································103
5.3 Photolithography·······································105
5.4 Etch······················································109
5.5 Metallization ··········································· 110
5.6 Process Integration ····································101
Unit 6 Reading Practice······················ 128
6.1 Paper ····················································128
6.2 Patent····················································140
6.3 Manual Guide ··········································147
Unit 7 Writing Practice························ 160
7.1 Structure of Paper······································160
7.2 Example 1 ··············································165
7.3 Example 2 ··············································171